Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.
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Component temperatures shall be measured at the top center of the package body. A UNIT of desiccant is de? A solution j-st-033b.1 addressing j-st-033b.1 problem is to derate the exposure times based on the knowledge of moisture diffusion in the component packaging materials refer to JESDA Any standard involving a complex technology draws material from a vast number of sources. Such SMD packages are not at risk and do not require moisture precautionary handling.
Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement. If dried and sealed in i-std-033b.1 MBB with fresh desiccant, the shelf life is reset. This document describes the standardized levels of? Devices require bake, before mounting, if: The body temperature during re? Humidity conditions can be achieved by placing combinations of molecular sieve desiccant, glycerin, and water inside the chamber.
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Refer to Clause 6. Printing in the indicating spot colored area will affect hue measurement.
Impose following two exposure conditions: If the time limit is exceeded the packages should be baked according to Table to restore the? The following assumptions were used in calculating Table Refer to Clause 6 for the baking of populated boards. This method will minimize moisture related component damage. Requirement, paragraph number Test Method numberparagraph number The referenced paragraph number has proven to be: Storage of SMD packages in a dry cabinet should be limited to a maximum time per Table All comments will be collected and dispersed to the appropriate committee s.
When identifying a bake cycle, the maximum exposure temperature and maximum rate of temperature change of components and materials on the subject printed wiring assembly must be considered, and an appropriate time temperature pro? HIC Testing Method To function properly, the spots must show a visually perceptible color change to indicate a change in the amount of humidity.
Nominally, an acrylic box with a volume of approximately 2 cubic feet, having facilities for access to the box interior while maintaining atmosphere is used.
This may present an additional risk, which should be evaluated. If a higher bake temperature is required, SMD packages must be removed from the low temperature carriers to thermally safe carriers, baked, and returned to the low temperature carriers. C If blank, see adjacent bar code label 3.
This is particularly critical if SMD packages are handled under low humidity conditions e. This will reset the?
Set the chamber to the? If the bag is to be resealed refer to Clause 4. For a stacked die or BGA package with internal planes that impede moisture diffusion the actual bake time may be longer than that required in Table if packages have had extended exposure to factory ambient before bake.
J-std-033h.1 dry cabinet should not be considered a MBB. Such processes are not allowed for many SMDs and are not covered by the component quali? After bake, must be re?
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In ip cases it is applicable to other nonhermetic surface mount SMD packages. This can be accomplished by dry pack according to Clause 3.
If partial lots are used, the remaining SMD packages must be resealed or placed in safe storage within one hour of jedfc opening see Clause 5. If one hour exposure is exceeded, refer to Clause 4. If more than three are required for any reason, the supplier should be consulted reference J-STD The bake times speci? Acceptable safe storage conditions for SMD packages classi?