IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.
|Published (Last):||24 April 2005|
|PDF File Size:||15.85 Mb|
|ePub File Size:||15.74 Mb|
|Price:||Free* [*Free Regsitration Required]|
Solder Joint Reliability
The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. See More See Less.
Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits.
When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.
Training Media Permissible Uses. Representative temperature profile for thermal cycle test conditions.
Solder Joint Reliability | NTS
Common test specifications include:. Product Description Product Details Back.
Per IPC, temperature extremes are based on the product category with ipcc low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material.
Please allow 2 business days for us to review and process your order.
This provides you with useful technical information for future designs, saving you time and money. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints.
Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures.
Thermal Cycling is the most common method of testing Solder Joint Reliability. The electrical resistance is continuously monitored during testing using ipcc loggers.