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IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.

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Solder Joint Reliability

The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. See More See Less.

Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits.

When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.


Training Media Permissible Uses. Representative temperature profile for thermal cycle test conditions.

Solder Joint Reliability | NTS

Common test specifications include:. Product Description Product Details Back.

Per IPC, temperature extremes are based on the product category with ipcc low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material.

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Thermal Cycling is usually performed at a transition rate of less than or equal to 20C per minute i;c 10 to 14C per minute to avoid thermal shock with cycles per hour. To view this site, you must enable JavaScript or upgrade to a JavaScript-capable browser.

Javascript is disabled on your browser. We will continue to accept orders via e-mail and web during our office closure. Common test specifications include: Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.


This provides you with useful technical information for future designs, saving you time and money. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints.

Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures.

Thermal Cycling is the most common method of testing Solder Joint Reliability. The electrical resistance is continuously monitored during testing using ipcc loggers.