The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.
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Our target is to completely satisfy customer demands even on the most complex projects. This collaboration will strengthen the competitiveness of the semiconductor and system suppliers 3 design innovative MtM and SiP products in respect to reliability, quality, cost and shorter time mcromac market to ensure leadership in a global perspective.
These proprietary technology innovations are now readily available on a worldwide scale. Strategic realignment focusing on industrial growth markets Production Solutions for Innovators and Growth Markets.
We also specialize in the use of excimer lasers for microprocessing. The work is supported by five academic institute partners. The utilization of lasers possessing highest beam quality ensures excellent machining results regarding surface and edge quality with a minimum of damage to micromaf material and marginal materials loss.
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3D-Micromac Celebrates 15 Years, Opens New Building
Development of industrial-suited excimer-laser system for marking of ophthalmic lenses Brittle-rigid materials such as glass, ceramic and sapphire have excellent material properties that make them indispensible for use in the production of electronics.
Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. If you continue to use mifromac site we will assume that you are happy with it.
Those properties should be unchanged after cutting. Winner of the Saxon Innovation Prize Our micrkmac help increase production efficiency, optimize processes and lower costs in various areas of technology. For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells. In a period of 10 years 3D-Micromac AG has carved out a strong ,icromac for itself among manufacturers of laser micro-processing systems.
This is particularly true for silicon carbide SiC substrates, which are hard and brittle. 3f contactless cell handling enables processing without surface defects and microcracks.
These platforms are open to multiple users and for multiple applications. We develop processes, machines and turnkey solutions at the highest technical and technological level. At the end of the project a throughput of Wafer per hour should be reached.
3D-Micromac Celebrates 15 Years, Opens New Building | Business | Oct |
From the founding of our company until today we have constantly been able to achieve important milestones: From the founding of our company until today we have constantly been able to achieve important milestones:. This should lead to an increased lifetime of the solar modules. The focus here is on thin glass, which offers advantages over plastic as a substrate due to its outstanding barrier properties. With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields.
Whether Standard System or Special Solution: Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The electrical and mechanical properties of the cells after cutting are in the focus of the investigations.
Excellent Support and Service. All components have to be adapted to the requirements of the new high efficiency laser processes. All systems use UV lasers for permanent marking. The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates.